Industrial Polymers & Advanced Materials (8 hrs) · Engineering Chemistry

Engineering Synthetics: Phenol-formaldehyde, Epoxy resins and Silicones

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Engineering Synthetics: Phenol-Formaldehyde, Epoxy Resins, Silicones

1. Phenol-formaldehyde (bakelite family)

Condensation of phenol + formaldehyde.

  • Acid catalyst + excess phenol → novolac (linear, thermoplastic); heating with hexamine cross-links it to bakelite (thermoset 3D network).
  • Base catalyst + excess formaldehyde → resol/resite directly to cross-linked bakelite.
  • Properties: hard, heat/chemical resistant, electrical insulator, dark colour.
  • Uses: electrical switches, plugs, handles, PCB laminates, adhesives, brake linings.

2. Epoxy resins

Made from bisphenol-A + epichlorohydrin → prepolymer with terminal epoxide rings; cured with hardener (amine/anhydride) which opens rings and builds 3D network:

epoxide ring+H2N−R→cross-linked network (–CH(OH)–CH2–N links)\text{epoxide ring} + H_2N-R \to \text{cross-linked network (–CH(OH)–CH}_2\text{–N links)}
  • Properties: outstanding adhesion (polar –OH + ether groups bond to almost anything), low shrinkage on cure, chemical/corrosion resistance, good electrical insulation.
  • Uses: structural adhesives (Araldite), protective coatings (tanks, ships), composites (carbon-fibre aircraft parts, wind blades), potting/encapsulation of electronics, flooring.
  • Limitation: UV yellowing outdoors unless top-coated; hardener ratio must be exact.

3. Silicones (polysiloxanes)

Backbone of alternating Si–O instead of C–C: repeat unit

[–Si(CH3)2–O–]n(polydimethylsiloxane, PDMS)[–Si(CH_3)_2–O–]_n \quad \text{(polydimethylsiloxane, PDMS)}

Made by hydrolysis of dimethyldichlorosilane followed by condensation.

  • Why special: Si–O bond is long, flexible, partly ionic → very low TgT_g (~−125 °C), water-repellent (methyl groups outward), stable from −60 to 250 °C, biocompatible, good dielectric.
  • Forms tuned by cross-linking: fluids/oils (lubricants, antifoam, hydraulic fluid), greases, rubbers (seals, tubing, baking moulds, implants), resins (heat-resistant paints, electrical insulation).
Resin Monomers Type Star property Typical use
Phenol-formaldehyde phenol + formaldehyde thermoset hard insulator switches, handles
Epoxy bisphenol-A + epichlorohydrin thermoset (needs hardener) strongest adhesion adhesives, composites
Silicone chlorosilanes → Si–O–Si fluid/rubber/resin heat-stable, water-repellent sealants, implants, oils

Exam Points

  • Monomers + novolac vs resol conditions for bakelite (3 marks).
  • Epoxy cure reaction + two properties + two uses (3 marks).
  • Silicone structure (Si–O backbone), why heat-stable/hydrophobic, three forms with uses (5 marks favourite — draw repeat unit).
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